n.倒装
adj.倒装
The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers. 倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。
Pb is exempted if its composition is >85%. As for the flipchip bump, how do we measure this composition? 问:成分大于85%25的铅不在指令范围内．如果是倒装焊,我们应该怎样测量它的成分？
The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%. 倒装焊晶片市场预计年增长37%25，而整体IC增长仅8%25。
